Tom McCune

Tom McCune specializes in advanced packaging, with experience in substrate/interposer process development and integration, materials R&D, 2.5D and 3D heterogeneous integration, glass panel substrates, and equipment design and sourcing. Tom has built a career at the intersection of emerging technologies, materials science, pilot line integration, and strategic program development—bridging the gap between cutting-edge research and scalable manufacturing. 

At Natcast he supported key initiatives under the CHIPS and Science Act. He identified advanced packaging research opportunities to improve AI, HPC, and data center efficiency. In parallel, Tom conducted technical evaluations of U.S.-based startups for the Natcast Investment Fund. His advisory work on hybrid bonding assembly and process flow design informed early planning and infrastructure for the NAPPF, ensuring alignment between R&D capabilities and commercial manufacturing readiness. Tom also developed review packages to define the state of the art and future trends for FOWLP, 3D heterogeneous integration, hybrid bonding, & emerging substrate architectures.  

Prior to Natcast, Tom was a Senior Advanced Packaging R&D Engineer at Intel, driving pathfinding and integration for EMIB and Foveros technologies. He led the development and qualification of next-generation solder resist materials for scaling interconnect pitch, improving lithography capability, yield, and reliability for early test vehicles. As the solder resist technical lead, he coordinated model-based problem-solving efforts with cross-functional teams in design, assembly, and integration. Within Intel’s glass substrates program, Tom led manufacturing readiness, process design, and supplier collaboration for new substrate tooling, leading to Intel’s first demonstration of Foveros 3D Meteor Lake substrates with glass panel cores. 

Tom holds an M.S. & B.S. in Materials Science & Engineering from Cornell University. He now brings his research and industry experience to startups, research institutions, and industry partners seeking to define and deploy the next generation of advanced packaging technologies.